Our Services
Our value to you
Deposition
Metal deposition
By e-beam, thermal and sputtering deposition. Metals available for coating are Pt, Ru, Pd, Au, Ag, Co, Ti, Cu, Al, Ta, Cr, Sn, and Ni.
Precious metals (Gold, Silver, Platinum, Palladium). Deposition of the desired
thickness (1-1000nm) can be carried out on single or multiple substrates (glass,
plastic, paper, silicon wafer, quartz, sapphire) with dimensions up to 4-inch.
Single or multiple layer deposition can be performed as well.
Plasma Enhanced Chemical Vapor Deposition (PECVD)
Deposition of Silicon Oxide and Silicon Nitride layers at low growth temperatures
down to 80°C can be performed. SiO2 and SixNy layers up to 500nm thickness.
Substrate maximum size up to 6-inch.
Atomic Layer Deposition (ALD)
Deposition of various metal-oxide layers of great uniformity and conformity can
be performed on flat, as well as on 3D curved, substrates. Deposition is done at
the temperature range of 50°C-250°C, allowing thus the use of photolithographic lift-off procedures. Ultrathin films down to 1 nm and up to100-200nm can be achieved with great uniformity. Metal Oxides such as ZrO, HfO (high K dielectrics) ZnO, Al 2 O 3, and TiO2 are available.
Parylene Conformal coating Deposition
Parylene is the trade name for a variety of chemical vapor deposited poly(p-xylylene) polymers used as moisture and dielectric barriers. Parylene films have been used in various applications, including Hydrophobic coating (moisture barriers, e.g., for biomedical hoses Barrier layers (e.g., for a filter, diaphragms, valves Microwave electronics Implanted Medical devices Sensors in a rough environment (e.g., automotive fuel/air sensors). Electronics for space travel and military Corrosion protection for metallic surfaces.
Reinforcement of micro-structures Protection of plastic, rubber, etc., from harmful environmental conditions Reduction of friction, e.g., for guiding catheters, acupuncture needles and microelectromechanical systems.
Thin to thick Parylene layers can be deposited on any substrate. The Parylene deposition process is carried out at room temperature, thus allowing the conformal covering of temperature sensitive materials.
Silicon Wafer Etching Processes
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RIE ( Reactive Ion Etching) and DRIE ( Deep Reactive Ion Etching) services for the controlled gas-phase plasma etching of silicon substrates are available.
Silicon, Silicon Oxide, Organic films etching using a variety of plasma chemistries is performed with gasses such as CF4, CHF3, C4F8, SF6, O2, and Ar. Etching services can be done separately or as part of photolithographic processed:
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RIE (Reactive Ion Etching) & DRIE (Deep RIE) services.
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Etching silicon, silicon oxide, silicon nitride, organic films & more.
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O2, Ar and flourine based gases are available.
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Selective wet-etch for most elements.
Photolithography processes
- Design & prepare photomasks at high resolution (>0.5µm).
- Adhesion and primers resists.
- Positive & negative photoresists.
- 3D structures, Microfluidics and biocompatible features can be fabricated
E-beam Lithography
E-beam lithography is a known process for the high resolution writing down to the ≤50nm resolution range. We offer lithography designs, lithography writings and post lithography depositions and lift-off.
Post Lithography processes
Metal, oxides deposition and lift-off steps can be carried out as a whole package.
Lithography Services
We offer photolithography, Ebeam Lithography, and FIB services. Also, we can design and produce photolithography masks.
Photomask
Design and preparation of photomasks at low resolution (~100µm), or high resolution (down to 1 µm) by direct laser writing technology ( on soda lime or quartz).
Characterization Services
By a myriad of approaches such as XPS, AFM, optical microscopy, confocal microscopy, FTIR, ToF-sims spectroscopy, SEM, TEM, and electrochemistry
​Electrical Characterization Services
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Probe Station in various environments (Vaccuum, 100°C-250°C).
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4 Probe.
Surface Characterization Services
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Surface chemical characterization.
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Surface morphology.
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Micro 3D characterization.
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Microscopy (Light, Fluorescence).
Surface Modification
Chemical
​We can modify virtually any material of interest with any kind of molecules to achieve required surface specification. We can provide any solvent and chemical to create hydrophilic, hydrophobic, chemical active/inactive substrate, and supply different environment (N2, Ar, Vacuum, Oven and etc). We can follow given protocols, or research new one if needed.
Biological
​We have vast experience with protein immobilization, cross-linking and multi-step biosensors modification. We now how to handle biological modified samples and understand their limitations. We can supply antibodies, aptamers, proteins and more.
MEDICAL DEVICE TESTING & PRODUCT ASSESSMENT
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Thanks to our knowledge in biosensors testing and medical devices assessments, we offer can review implants, sensors, gigs and more:
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Materials characterization and a variety of tests.
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Tests for electrical, mechanical and functional properties.
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Integration & simple gig production.
The design and realization of applications based on nano and micro-electrical devices
Nanomaterials synthesis and characterization
Nanotubes, Nanowires and, nanoparticles.
Designing and construction of nanomaterial-based electrical devices
Using nanofabrication and microfabrication techniques.
Electrochemistry-based design and fabrication of devices and sensors
Using State of the art electrochemical equipment and top experts.
Fabrication of Electrical Devices and Sensors
Thermal Annealing Services
Rapid Thermal Processing (RTP)
Samples can be heated in order to activate dopants, change substrate interfaces, crystallize
deposited films, change states of grown films, repair damage from ion implantation, move dopants, from a film into the wafer substrate or improve metal-semiconductor interface conductivity.
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Maximum temperature of 1200°C
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Processing can be done in forming (H2 + N2), Nitrogen, Oxygen and Ar
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Sample up to 6-inch
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Annealing Oven and Furnace
Treatment for surface relaxation, thin film granulation, surface oxidation or
hydrogen curing and CVD processes.
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Maximum temperature of 1200°C
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Plasma enhanced
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Long duration annealing process
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Sample up to 4-inch
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Ovens for Chemical Reactions
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Vacuum and inert environment
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Can process up to 40 liters at once
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Maximum temperature of 400°C
Scientific Consulting
3D printing services
Via FDM (Fused Deposition Modeling) or SLA (Stereolithography
Apparatus) technologies. Large variety of printing materials are available.
Laser cutting and engraving services.
Nanochemika scientific solutions